JIS Z 3197 PDF

JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content(mass %). ~ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test( Ω).

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Ideally used mainly by consumer products assemblies’. Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid.

CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents

Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof. Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate. Colophony type non-halide cleaning-free soldering flux for lead-free solder wire. CN CNA en.

MATSUTA 旺興達有限公司

Aqua-soluble core flux was developed for used by assemblies’ manufacturer utilizing water-soluble wave soldering fluxes and aqua-soluble solder jiis SME process The flux is thermally heat stable with minimal fumes and odor.

A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof.

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Halogen-free lead-free soldering paste for radiator and preparation method thereof. The flux according to claim 1, wherein: Environment protection efficient water-based circuit board cleaning agent and preparation thereof. Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof.

A flux according to claim 1, wherein: Brass and copper for consumer product. Post jjis residues can be washed with lukewarm water O C. The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron.

A soldering flux as claimed in claim 5, characterized in that: The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. The film-forming substance in the raw material, i.

RM-5 (Flux for BGA / CSP Solder Ball)

The residua can be completely removed with luke-warm simple water rinse. Clear residue no-clean halide free flux used by assemblies’ manufacturer utilizing low solid no-clean wave soldering fluxes.

Water – soluble core jus. CN CNA en The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance. The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1.

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Aqua-soluble core flux for used by assembly’s manufacturer utilizing water washing cleaning process. Fast and excellent instant wetting action used mainly by consumer products assemblies manufacturer.

TAMURA CORPORATION TLF Cleanable No-Clean Solder Paste |タムラ製作所

Preparation and use of the same method as in Example 1. More than 90 SnPb. Solder fillets can left up to 24 a and still remains shiny prior sending for post washing with water. Brass and copper Brass and copper for consumer product. Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.

This flux is a high activity, heat stable with minimal fumes and odor. Low-splash and halogen-free welding agent for tin wires and preparation method thereof. More than 90 SnPb More than 80 Sn

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