Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.
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After the vacuum is released, the fluid flows into the part. Conformal coating is a thin insulating coating applied by various methods. This type of packaging can also be divided into two main types: It can be very economical, but somewhat difficult to achieve consistent process quality.
Electronic packaging – Wikipedia
Today it is most widely used to protect semiconductor components from moisture and mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together.
Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Molded plastic cases and structural parts can be made by a variety of methods, offering hermigicity in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly.
Pl can be post-processed hegmiticity provide conductive surfaces.
Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed packags board Surface-mount technology Through-hole technology. Parts are submerged in a polymerizable monomer or solvent-based low viscosity plastic solution. The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation.
Views Read Edit View history. High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, o temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible lightsalt spray, explosive shock, and many more. Retrieved from ” https: Aluminum die castings are more common than iron or steel sand castings.
Potting can be done in a pre-molded potting shell, or directly in a mold. A designer must balance many objectives and practical considerations when selecting packaging methods. Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. It is also commonly used in high voltage products to allow live parts to be placed closer together, so that the product can be smaller.
Examples are injection molding, transfer molding, vacuum forming, and die cutting. They are fairly common in microwave assemblies for aerospace use, where precision transmission lines require complex metal shapes, in combination with hermetically sealed housings.
Many electrical products require the manufacturing of high-volume, low-cost parts such as enclosures or covers by techniques such as injection hermiticitu, die casting, investment casting, and so on. Hermetic metal packaging began life hermiticihy the vacuum tube industry, where a totally leak-proof housing was essential to operation.
Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics.
Industrial design Packaging Packaging microfabrication Chip carriers. Piece part costs are high, but there is little or no cost for custom tooling, and first-piece deliveries can take as little as half a day.
It’s widely used on mass-produced items such as axial-lead resistors, and sometimes on printed circuit boards. This also excludes dirt and conductive contaminants such as impure water from sensitive areas. Liquid filling is sometimes used as an alternative to potting or impregnation. Electronic packaging is a major discipline within the field of mechanical engineering. In these, the individual diodes are mounted in an array that allows the device to produce a greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface mount types, individually on a circuit board.
This industry developed the glass-seal electrical feedthrough, using alloys such as Kovar to match the coefficient of expansion of the sealing glass so as to minimize mechanical stress on the critical metal-glass bond as the tube warmed up.
Please help improve this article by adding citations to reliable sources. Quantities tend to be small; sometimes only one unit of a custom design is required.