IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.
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Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures.
The electrical resistance is continuously monitored during testing using data loggers. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints. Per IPC, temperature extremes are based on the product category with the low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material.
Representative temperature profile for thermal cycle test conditions. Product Description Product Details Back.
Solder Joint Reliability | NTS
Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. We will continue to accept orders via e-mail and web during our office closure.
This provides you with useful technical information for future designs, saving you time and money. Common test specifications include:. Please allow 2 business days for us to review and process your order.
Thermal Cycling is the most common method of testing Solder Joint Reliability. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability.
See Iipc See Less. Common test specifications include: Provides specific ic methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.